Recertified Computer Memory /
DDR2 /
OCZ DDR2 PC2-8500 / 1066 MHz / Reaper HPC Edition / 4GB / Dual Channel
OCZ DDR2 PC2-8500 / 1066 MHz / Reaper HPC Edition / 4GB / Dual Channel
| The latest PC titles that make use of DirectX 10 crave more than the standard 2GB of RAM for the ultimate gameplay experience and the highest settings. Shipping Weight: 0.51 Lbs (0.23 Kgs) Out of stock. |
| Capacity: 4GB (2x2048) D/C |
| Standard: PC2-8500 |
| Single module or dual kit: Dual Channel Kit |
| Memory speed: 1066MHz DDR2 |
| Cas latency: CL 5-5-5-18 (CAS-TRCD-TRP-TRAS) |
| Voltage: 2.1 - 2.2 Volts |
| Warranty: OCZ Lifetime Warranty |
| Series: Reaper Series |
To ensure superior stability and performance over the entire life of the memory the Reaper HPC Series makes use of an innovative cooling solution to more effectively dissipate heat produced by high-speed memory. The thermo-conductive copper heat pipe conduit is ideal for overclocking where every degree matters.
The new modules also offer instant overclocking right out of the box with EPP (Enhanced Performance Profiles) programmed into the SPD. PC2-8500 Reaper modules will immediately boot at the rated specs on the latest generation of NVIDIA® SLI™ chipsets. EPP eliminates the need for manual configuration and makes the benefits of overclocking available to the complete range of consumers looking to get the most out of their systems.
The PC2-8500 Reaper HPC Series will be available in 4GB (2x2048MB) Dual Channel Kits. Although the OCZ Reaper HPC series can meet all enthusiast demands, this high-capacity, high performance memory can become a user-friendly household item for the complete range of consumers looking to maximize system performance with additional RAM.
As part of OCZ's line-up of premium memory, Reaper HPC PC2-8500 modules are backed by a Lifetime Warranty and industry-leading technical support so you can push your high-performance memory to its limit.
* The Reaper HPC series uses heat pipe technology to rapidly remove heat from the main body of the memory modules and conduct the thermal load to the extended radiator fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.
