Recertified Computer Memory / DDR3 / OCZ DDR3 PC3-10666 / 1333 MHz / ReaperX HPC / Enhanced Bandwidth / 4GB Dual Channel

OCZ DDR3 PC3-10666 / 1333 MHz / ReaperX HPC / Enhanced Bandwidth / 4GB Dual Channel


The latest OCZ PC3-10666 ReaperX 4GB memory kits feature the ideal blend of speed, latency, bandwidth, and up to 4GB capacities to help DirectX-10 PC games reach their full potential on the latest DDR3 platforms.

Shipping Weight: 0.78 Lbs (0.35 Kgs)
Out of stock.

$ 148.89

OCZ DDR3 PC3-10666 / 1333 MHz / ReaperX HPC / Enhanced Bandwidth / 4GB Dual Channel
Capacity:
4GB (2x2048MB) D/C
Standard:
PC3-10666
Single module or dual kit:
Dual Channel Kit
Memory speed:
1333 MHz DDR3
Cas latency:
6-5-5-20 (CAS-TRCD-TRP-TRAS)
Voltage:
1.85 Volts
Warranty:
OCZ Lifetime Warranty
Series:
Reaper HPC Series
The latest OCZ PC3-10666 ReaperX 4GB memory kits feature the ideal blend of speed, latency, bandwidth, and up to 4GB capacities to help DirectX-10 PC games reach their full potential on the latest DDR3 platforms. PC3-10666 ReaperX 4GB kits are designed to help deliver exceptional gaming visuals and overclocking potential, with breakneck speeds and tight latencies coupled with advanced cooling technology to ensure your high-powered gaming PC maintains unsurpassed stability.

The ReaperX series provides enthusiasts leading-edge cooling technology, with each memory chip in direct contact with a thermo-conductive pipe that guides heat away and quickly dissipates it through the aluminum fin array.

As one of OCZ's legendary Enhanced Bandwidth (EB) editions, the ReaperX 4GB kit increases effective memory bandwidth through the optimization of memory latencies between the system memory, the chipset, and memory controller, resulting in the ideal balance of speed and enhanced timings.

* ReaperX HPC (Heat Pipe Conduit) modules offload heat with extreme efficiency due to a new dual copper heat pipe design. Each memory chip is in direct contact with a thermo-conductive pipe that guides the performance robbing heat away from key memory components and quickly dissipates it through the aluminum fin array. The addition of the extended fin array nearly doubles the total surface area available for heat dissipation while the heat pipes warrant near isothermicity throughout the entire design. The result is a doubling in effective heat dissipation at equal delta t or, in real systems, a significantly lower operating temperature of the memory modules.

**OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 1.9V without invalidating their OCZ Lifetime Warranty.

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