OCZ DDR3 PC3-12800 / 1600MHz / Platinum Edition / 2GB Dual Channel / Enhanced Bandwidth Edition

The PC3-12800 EB (Enhanced Bandwidth) Edition is built with ardent enthusiasts in mind, featuring the ideal balance of sheer DDR3 speed and enhanced timings. Shipping Weight: 0.27 Lbs (0.12 Kgs) Out of stock. $ 49.50

The PC3-12800 EB (Enhanced Bandwidth) Edition is built with ardent enthusiasts in mind, featuring the ideal balance of sheer DDR3 speed and enhanced timings. This memory is specially designed and optimized for the latest generation of ASUS motherboards. As one of OCZ's legendary Enhanced Bandwidth (EB) editions, the PC3-12800 Platinum kit increases effective memory bandwidth through the optimization of latencies between the RAM, chipset, and memory controller, resulting in the ideal balance of speed and enhanced timings. At 1600MHz, the PC2-12800 EB edition is rated for 7-6-6 timings on ASUS platforms.

OCZ Platinum DDR3-1600 modules will be available in 2x1024MB dual channel kits. OCZ has been working closely with the leading platform providers to ensure optimal performance and compatibility on all the next generation computing platforms that will be introduced later this year.

Each module is 100% hand-tested for quality assurance and compatibility and features a proprietary platinum-mirrored XTC (Xtreme Thermal Convection) heatspreader for the most effective heat dissipation. As part of OCZ-s line-up of premium memory, the DDR3 series is backed by a Lifetime Warranty and industry-leading technical support for unparalleled peace of mind.

Not up to speed on DDR3 technology? Please enjoy these DDR3 FAQs.

* All Modules are tested in two module kits. Due to additional bus load, four module configurations may have to be run at lower frequency and relaxed latencies for stable operation. Test specifications are based on dual core CPUs only. If quad core CPUs are used, higher bus thresholds and core arbitration may necessitate lowering the memory frequency below tested specs.


**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.


***OCZ EVP (Extended Voltage Protection) is a feature that allows performance enthusiasts to use a VDIMM of 1.95V without invalidating their OCZ Lifetime Warranty.