Recertified Computer Memory /
DDR3 /
OCZ DDR3 PC3-14400 / 1800MHz / Platinum Edition / 2GB Dual Channel
OCZ DDR3 PC3-14400 / 1800MHz / Platinum Edition / 2GB Dual Channel
| Tested and qualified to reach DDR3-1800 with ample overclocking capability and aggressive latencies, the OCZ PC3-14400 Platinum Edition is a true milestone. Shipping Weight: 0.27 Lbs (0.12 Kgs) In stock. |
| Capacity: 2GB (2x1024MB) D/C |
| Standard: PC3-14400 |
| Single module or dual kit: Dual Channel Kit |
| Memory speed: 1800MHz DDR3 |
| Cas latency: CL 8-8-8-24 (CAS-TRCD-TRP-TRAS) |
| Voltage: 1.95 Volts 1.95 - 2.0V EVP*** |
| Warranty: Lifetime Warranty |
| Series: Platinum Series |
OCZ Platinum DDR3-1800 modules are available in up to 4GB (2x2048MB) dual channel kits. OCZ has been working closely with the leading platform providers to ensure optimal performance and compatibility on all the next generation computing platforms that will be introduced later this year.
Each module is 100% hand-tested for quality assurance and compatibility and features a proprietary platinum-mirrored XTC (Xtreme Thermal Convection) heatspreader for the most effective heat dissipation. As part of OCZ-s line-up of premium memory, the DDR3 series is backed by a Lifetime Warranty and industry-leading technical support for unparalleled peace of mind.
Not up to speed on DDR3 technology? Please enjoy these DDR3 FAQs.
* All Modules are tested in two module kits. Due to additional bus load, four module configurations may have to be run at lower frequency and relaxed latencies for stable operation. Test specifications are based on dual core CPUs only. If quad core CPUs are used, higher bus thresholds and core arbitration may necessitate lowering the memory frequency below tested specs.
**XTC (Xtreme Thermal Convection) heatspreaders optimize the thermal management of memory modules by promoting greater airflow by means of micro-convection throughout what is usually the dead air space inside conventional heatspreader designs. In this manner, build-up of heat is avoided and thermal dissipation of the memory components is offloaded more efficiently through the honeycomb design. At the same time, mechanical stability is maintained.
